Samsung zHBM

Track; not yet

Why

zHBM is a vendor concept model, not a product: the 8x/10x/3x figures are projections against an unreleased HBM5 baseline, no production timeline exists, and the hardest dependency — roughly 1 kW of heat extraction through the DRAM stack without losing data retention — sits with third-party thermal-material and test vendors rather than with Samsung. Nothing here is procurable or architecturally actionable in this planning horizon, but the direction — memory-on-logic replacing beside-the-die HBM — would materially reset AI inference cost-per-token if it lands, so it warrants a watch rather than a dismissal.

Next

Set a re-check trigger on the next Samsung memory roadmap disclosure (SEMICON Korea 2027 / FMS 2027) and on JEDEC HBM5 standardization: the record moves off 'track' only when a named mass-production year appears AND an independent party (analyst teardown, accelerator vendor, or peer-reviewed thermal study) validates the thermal-resistance claim.